TSMC to break ground on first European 12-inch plant in Dresden, Germany, tomorrow · TechNode

TSMC to break ground on first European 12-inch plant in Dresden, Germany, tomorrow · TechNode

2024-08-19 08:38:51

TSMC Chairman C.C. Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on its first

TSMC aims to promote mass production of the second generation of 3nm chips (N3E process) in 2024.
TSMC aims to promote mass production of the second generation of 3nm chips (N3E process) in 2024. Credit: TSMC

TSMC Chairman C.C. Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on its first European 12-inch plant in Dresden, Germany, according to the Taiwanese media outlet Economic Daily News. The facility, with an initial monthly capacity of 40,000 wafers, will introduce 28/22nm planar CMOS (complementary metal-oxide-semiconductor) technology and 16/12nm FinFET (fin field-effect transistor) processes. In August 2023, TSMC, Bosch, Infineon, and NXP Semiconductors announced the formation of the European Semiconductor Manufacturing Company (ESMC), with each firm holding a 10% stake. With a total investment of 10 billion euros, the German plant will operate under ESMC and is expected to start by late 2027. [Economic Daily News, in Chinese]